Solidification recalescence curve of Cu55Ni45 alloy.
Fig. 4
EBSD characterization of Cu55Ni45 alloy with undercooling of 70 K. (A) Grain boundary diagram of microstructure of 70 K undercooling alloy, (B) grain boundary orientation diagram, (C) pole diagram of (B, D). distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.
Fig. 5
The relationship between dimensionless dendrite remelting fraction and undercooling of Cu55Ni45 alloy.
Fig. 6
EBSD characterization of Cu55Ni45 alloy with undercooling of 272 K. (A) Grain boundary diagram of microstructure of 272 K undercooling alloy, (B) grain boundary orientation diagram, (C). pole diagram of (B, D). Distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.
Fig. 7
(A) Relationship between stress accumulation and initial undercooling during rapid solidification of Cu55Ni45alloy, (B) Microstructure of Cu55Ni45 alloy at ΔT = 187 K, (C) microstructure of Cu55Ni45 alloy at ΔT = 227 K.
Fig. 8
(A) Evolution of average grain size and undercooling of Cu55Ni45 alloy, (B) evolution of microhardness and undercooling of Cu55Ni45 alloy.