Area and power efficient divide-by-32/33 dual-modulus pre-scaler using split-path TSPC with AVLS for frequency divider

Publié en ligne: 21 oct. 2023

Pages: 403 - 412

Reçu: 14 sept. 2023

DOI: https://doi.org/10.2478/jee-2023-0048

Mots clés

AVLS, CMOS, DMPS, Split-path TSPC, TSPC

© 2023 Premananda Belegehalli Siddaiah et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.