To evaluate the antibacterial properties and effects of an orthodontic adhesive containing copper nanoparticles (NPs) on the material’s shear bond strength.
Antimicrobial activity was analysed by a disk diffusion test against
The adhesive with copper NPs showed a bactericidal effect against the bacteria under study. A significantly higher bond strength was obtained with the orthodontic adhesive that included 0.0100 wt% of copper NPs (15.23 ± 6.8 MPa) in comparison with the control group (9.59 ± 4.3 MPa). The ARI scores indicated that the groups were significantly different and strengthened by the incorporation of NPs (
The results of the present study suggested that an orthodontic adhesive, which included copper NPs, significantly increased material shear bond strength without adverse side effects on colour and appearance. The adhesive interface was strengthened by homogeneously dispersed copper NPs added as a nanofiller.