An evaluation of the antibacterial properties and shear bond strength of copper nanoparticles as a nanofiller in orthodontic adhesive
Publié en ligne: 15 août 2021
Pages: 42 - 48
Reçu: 01 oct. 2014
Accepté: 01 avr. 2015
© 2015 Liliana Argueta-Figueroa et al., published by Sciendo
This work is licensed under the Creative Commons Attribution 4.0 International License.