<abstract xmlns="http://www.w3.org/1999/xhtml"><p>We have extracted stress-strain field (SSF) gradient and divergence representations from nanoindentation data sets of bulk solids often used as thin film substrates: bearing and tooling steels, silicon, glasses, and fused silica. Oscillations of the stress-strain field gradient and divergence induced in the subsurface layer by the nanoindentation have been revealed. The oscillations are especially prominent in single indentation tests at shallow penetration depths, <italic>h</italic>&lt;100 nm, whereas they are concealed in the averaged datasets of 10 and more single tests. The amplitude of the SSF divergence oscillations decays as a sublinear power-law when the indenter approaches deeper atomic layers, with an exponent −0.9 for the steel and −0.8 for the fused silica. The oscillations are interpreted as alternating strain hardening-softening plastic deformation cycles induced in the subsurface layer under the indenter load.</p></abstract>

We have extracted stress-strain field (SSF) gradient and divergence representations from nanoindentation data sets of bulk solids often used as thin film substrates: bearing and tooling steels, silicon, glasses, and fused silica. Oscillations of the stress-strain field gradient and divergence induced in the subsurface layer by the nanoindentation have been revealed. The oscillations are especially prominent in single indentation tests at shallow penetration depths, h<100 nm, whereas they are concealed in the averaged datasets of 10 and more single tests. The amplitude of the SSF divergence oscillations decays as a sublinear power-law when the indenter approaches deeper atomic layers, with an exponent −0.9 for the steel and −0.8 for the fused silica. The oscillations are interpreted as alternating strain hardening-softening plastic deformation cycles induced in the subsurface layer under the indenter load.

Nanoindentation Response Analysis of Thin Film Substrates-II: Strain Hardening-Softening Oscillations in Subsurface Layer

Latvian Journal of Physics and Technical Sciences

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

We have extracted stress-strain field (SSF) gradient and divergence representations from nanoindentation data sets of bulk solids often used as thin film...

Nanoindentation Response Analysis of Thin Film Substrates-II: Strain Hardening-Softening Oscillations in Subsurface Layer

Publicado en línea: 22 may 2017

Páginas: 34 - 45

DOI: https://doi.org/10.1515/lpts-2017-0011

Palabras clave
elastic-plastic deformation, heterogeneity, nanoindentation, strain gradient plasticity, stress-strain field, subsurface layer

© 2017 Uldis Kanders et al., published by De Gruyter Open

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Nanoindentation Response Analysis of Thin Film Substrates-II: Strain Hardening-Softening Oscillations in Subsurface Layer

Publicado en línea: 22 may 2017

Páginas: 34 - 45

DOI: https://doi.org/10.1515/lpts-2017-0011

Palabras claveelastic-plastic deformation, heterogeneity, nanoindentation, strain gradient plasticity, stress-strain field, subsurface layer

© 2017 Uldis Kanders et al., published by De Gruyter Open

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Palabras clave
elastic-plastic deformation, heterogeneity, nanoindentation, strain gradient plasticity, stress-strain field, subsurface layer