Annealing temperature (°C) | Cu (at.%) | Cr (at.%) | O(at.%) | Cu/Cr ratio |
---|---|---|---|---|
As-deposited | 28.41 | 14.05 | 57.54 | 2.02 |
500 | 31.69 | 15.95 | 52.36 | 1.99 |
600 | 31.20 | 16.24 | 52.55 | 1.92 |
700 | 31.23 | 15.68 | 53.09 | 1.99 |
800 | 31.81 | 15.68 | 52.51 | 2.03 |
Annealing temperature (°C) | Carrier concentration (×1017 cm−3) | Hall Mobility (cm2/V-s) | Electrical resistivity (Ω-cm) |
---|---|---|---|
500 | 2.81 | 0.121 | 183 |
600 | 4.05 | 0.373 | 41 |
700 | 3.25 | 0.223 | 86 |
800 | 0.43 | 0.268 | 540 |