A Study on the Influence of Thermal Interface Material in Passively Cooled Electrical Components with Attached Heatsink

Online veröffentlicht: 22. Juli 2023

Seitenbereich: 95 - 104

Eingereicht: 02. Apr. 2023

Akzeptiert: 20. Apr. 2023

DOI: https://doi.org/10.2478/bipcm-2023-0007

Schlüsselwörter

FEA, heat sink, thermal, passive cooling, thermal pad, thermal interface material

© 2023 George-Gabriel Chiriac et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.