A Method For Fine Bonding Wire Detection Using Light Diffraction
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12. Dez. 2017
Über diesen Artikel
Online veröffentlicht: 12. Dez. 2017
Seitenbereich: 112 - 124
Eingereicht: 02. Dez. 2010
Akzeptiert: 01. Feb. 2011
DOI: https://doi.org/10.21307/ijssis-2017-429
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© 2011 Yong Xiao et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Xiao, Yong
College of Information Engineering, Shenyang University of Chemical TechnologyShenyang, China
Wang, Xiaoyan
College of Information Engineering, Shenyang University of Chemical TechnologyShenyang, China
Zhu, Kuanyi
Dept.of Electronic and Computer Engineering, Ngee Ann PolytechnicSingapore
Ge, Xiaoyu
College of Information Engineering, Shenyang University of Chemical TechnologyShenyang, China
Sun, Jingna
College of Information Engineering, Shenyang University of Chemical TechnologyShenyang, China