Bonding mechanism between the AlN ceramic matrix and the copper-based metal cladding layer
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Mar 15, 2025
About this article
Article Category: Research Article
Published Online: Mar 15, 2025
Page range: 42 - 50
Received: May 06, 2024
Accepted: Feb 09, 2025
DOI: https://doi.org/10.2478/msp-2025-0004
Keywords
© 2025 Song Wang, published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Wang, Song
State Power Investment Group Yunnan International Power Investment Co., LtdKunming, China
Lu, Hao
School of Electrical Engineering, Xinjiang UniversityUrumqi, China
Shu, Fengyuan
School of Chemical Engineering and Technology, Sun Yat sen UniversityZhuhai, China
Zhang, Xin
New Energy Technology Research Institute, State Power Investment Corporation Science and Technology Research InstituteBeijing, China
Li, Guibian
Shanxi Fenglei Drilling Tools Co. Ltd.Houma, China