Open Access

Impact of firing temperature on insulating properties of Low Temperature Co-fired Ceramics


Cite

[1] Dziedzic A., Nowak D., Radioengineering, 22 (2013), 218.Search in Google Scholar

[2] Ur-Rehman M., Adekanye M., Tariq Chattha H., Nano Commun. Netw., 18 (2018), 72.10.1016/j.nancom.2018.03.003Search in Google Scholar

[3] Jantunen H., Kangasvieri T., Vähäkangas J., Leppävuori S., J. Eur. Ceram. Soc., 23[14] (2003), 2541.10.1016/S0955-2219(03)00155-9Search in Google Scholar

[4] Nowak D., Dziedzic A., Microelectron. Reliab., 51[7] (2011), 1241.10.1016/j.microrel.2011.02.018Search in Google Scholar

[5] Jiang B., Muralt P., Maeder T., Sensor. Actuat. BChem., 221 (2015), 823.10.1016/j.snb.2015.06.127Search in Google Scholar

[6] Belavic D., Hrovat M., Dolanc G., Santo Zarnik M., Holc J., Makarovic K., Radioengineering, 21[1] (2012), 195.10.4071/CICMT-2012-WA14Search in Google Scholar

[7] Ma M., Khan H., Shan W., Wang Y., Ou J. Z., Liu Z., Kalantar-Zadeh K., Li Y., Sensor. Actuat. B-Chem., 239 (2017), 711.10.1016/j.snb.2016.08.073Search in Google Scholar

[8] Lin L., Ma M., Zhang F., Liu F., Liu Z., Li Y., Ceram. Int., 44[1] (2018), S129.10.1016/j.ceramint.2018.08.159Search in Google Scholar

[9] Manjakkal L., Synkiewicz B., Zaraska K., Cvejin K., Kulawik J., Szwagierczak D., Sensor. Actuat. B-Chem., 223 (2016), 641.10.1016/j.snb.2015.09.135Search in Google Scholar

[10] Radauscher E.J., Parker C.B., Gilchrist K.H., Di Dona S., Russell Z.E., Hall S.D., Carlson J.B., Grego S., Edwards S.J., Sperline R.P., Denton M., Stoner B.R., Glass J.T., Amsden J.J., Int. J.Mass Spectrom., 422 (2017), 162.10.1016/j.ijms.2016.10.021Search in Google Scholar

[11] Dorczynski M., Fabinska W., Roguszczak H., Golonka L., Proc. Device Packaging HiTEC HiTEN & CICMT, (2016), p. 47.Search in Google Scholar

[12] Da˛browski A., Rydygier P., Czok M., Golonka L., Microelectron. Int., 35 (2018), 146.10.1108/MI-12-2017-0070Search in Google Scholar

[13] Imanaka Y., Multilayered Low Temperature Cofired Ceramics (LTCC) Technology, Springer US, 2005.Search in Google Scholar

[14] Makarovic K., Meden A., Hrovat M., Holc J., Bencan A. Dakskobler A., Kosec M., J. Am. Ceram. Soc., 95[2], (2012), 760.10.1111/j.1551-2916.2011.05027.xSearch in Google Scholar

[15] Alias R., The Effects of Sintering Temperature Variations on Microstructure Changes of LTCC Substrate, in: Lakshmanan A. (Ed.), Sintering of ceramics – new emerging techniques, InTech, London, 2012, p. 59.10.5772/32873Search in Google Scholar

[16] Walker J. Maloney J., Gleason C., Holthus J., Smith B., Henry J., Graddy E., Sridharan S., Sakoske G., Proc. Device Packaging HiTEC HiTEN & CICMT, (2016), p. 136.Search in Google Scholar

[17] Heux A., Antou G., Pradeilles N., Delhote N., Karnfelt C., Gallee F., Maitre A., Ceram. Int., 44[18] (2018), 22609.10.1016/j.ceramint.2018.09.035Search in Google Scholar

[18] Makarovic K., Bencan A., Hrovat M., Holc J., Mali B, Kosec M., Bermejo R., Kraleva I., Int. J. Appl. Ceram. Technol., 10 [3] (2013), p. 449.Search in Google Scholar

[19] Barteczka B., Slobodzian P., Dabrowski A., Golonka L., Microelectron. Int., 31[3] (2014), 169.10.1108/MI-11-2013-0067Search in Google Scholar

[20] Nair D., Nair K. M., Souders K., Smith M., McCombs M., Parisi J., Mobley T., Thrasher B., (2010), Proc. International Symposium on Microelectronics: FALL 2010, Vol. 2010, No. 1, p. 242.Search in Google Scholar

[21] Kawaguchi S., Namiki K.C., Ohshio S., Nishino J., Saitoha H., Adv. Mater., 11-12 (2006), p.693.Search in Google Scholar

[22] Tsu R., McPherson J.W., McKee W.R., Proc. IRPS, (2000), p. 348.Search in Google Scholar

[23] Noguchi J., IEEE Electron Dev., 52[8] (2005), p. 1743.Search in Google Scholar

[24] Watson J., Castro G., J. Mater. Sci. Mater. Electron., 26 (2015), p. 9226.Search in Google Scholar

eISSN:
2083-134X
Language:
English
Publication timeframe:
4 times per year
Journal Subjects:
Materials Sciences, other, Nanomaterials, Functional and Smart Materials, Materials Characterization and Properties