1. bookVolume 36 (2018): Issue 3 (September 2018)
Journal Details
First Published
16 Apr 2011
Publication timeframe
4 times per year
access type Open Access

Fabrication of temperature sensor based on copper oxide nanowires grown on titanium coated glass substrate

Published Online: 02 Nov 2018
Volume & Issue: Volume 36 (2018) - Issue 3 (September 2018)
Page range: 460 - 468
Received: 24 Jul 2017
Accepted: 24 Apr 2018
Journal Details
First Published
16 Apr 2011
Publication timeframe
4 times per year

Single phase, adherent films of copper oxide nanowires (CuO NWs) were successfully grown on a glass substrate. Titanium nanofilm was pre-coated on the glass substrate to assist the growth of a layer adherent to the substrate. The copper film of 1.5 μm thickness was deposited via physical vapor deposition technique followed by thermal oxidation in air at various temperatures for 4 h. The product was characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), ultraviolet-visible (UV-Vis) and Fourier transformation infrared (FT-IR) spectroscopy to find the crystal structure, morphology, phases, and optical properties of the deposited films. The CuO NWs film with 60% transmittance at wavelengths greater than 800 nm was obtained. It can be used as an infrared thermal imaging filter and in optoelectronic devices. The fabricated temperature sensor exhibited high sensitivity in the temperature range of 20 °C to 180 °C.


[1] Jayatissa A.H., Guo K., Jayasuriya A.C., Appl. Surf. Sci., 255 (2009), 9474.10.1016/j.apsusc.2009.07.072Search in Google Scholar

[2] Ooi P.K., Ng S.S., Abdullah M.J., Hassan H.A., Hassan Z., Mater. Chem. Phys., 140 (2013), 243.10.1016/j.matchemphys.2013.03.028Search in Google Scholar

[3] Pham T.V., Rao M., Andreasson P., Peng Y., Wang J., Jinesh K.B., Appl. Phys Lett., 102 (2013), 032101.10.1063/1.4788680Search in Google Scholar

[4] Necmi S., Tulay S., Seyda H., Yasemin C., Semicond. Sci. Tech., 20 (2005), 398.10.1088/0268-1242/20/5/012Search in Google Scholar

[5] Ding T., Yang X., Bai L., Zhao Y., Fong K.E., Wang N., Demir H.V., Sun X.W., Org. Electron., 26 (2015), 245.10.1016/j.orgel.2015.07.044Search in Google Scholar

[6] Chang T.H., Hsu C.Y., Lin H.C., Chang K.H., Li Y.Y., J. Alloy. Compd., 644 (2015), 324.10.1016/j.jallcom.2015.04.107Search in Google Scholar

[7] Seongwan J., Young J.S., Sang H.J., Kang H.P., Catal. Commun., 81 (2016), 24.Search in Google Scholar

[8] Li A., Song H., Wan W., Zhou J., Chen X., Electrochim. Acta., 132 (2014), 42.10.1016/j.electacta.2014.03.123Search in Google Scholar

[9] Khalida A., Ikram U.H., Khan M., Powder Technol., 283 (2015), 505.10.1016/j.powtec.2015.06.023Search in Google Scholar

[10] Dahrul M., Alatas H., Irzaman, Procedia Environ. Sci., 33 (2016), 661.10.1016/j.proenv.2016.03.121Search in Google Scholar

[11] Vidyadharan B., Misnon I.I., Ismail J., Yusoff M.M., R. Jose., J. Alloy. Compd., 633 (2015), 22.10.1016/j.jallcom.2015.01.278Search in Google Scholar

[12] Jang J., Chung S., Kang H., Subramanian V., Thin Solid Films, 600 (2016), 157.10.1016/j.tsf.2016.01.036Search in Google Scholar

[13] Zhang Q., Zhang K., Xu D., Yang G., Huang H., Nie F., Liu C., Yang S., Prog. Mater. Sci., 60 (2014), 208.10.1016/j.pmatsci.2013.09.003Search in Google Scholar

[14] Zhao X., Wang P., Gao Y., Xu X., Xan Z., Ren N., Mater. Lett., 132 (2014), 409.10.1016/j.matlet.2014.06.124Search in Google Scholar

[15] Muhammad T.S.C., Khasan S.K., Sher B.K., Abdullah M.A., Sensor. Actuat. A-Phys., 246 (2016), 58.Search in Google Scholar

[16] Hsueh H.T., Hsueh T.J., Chang S.J., Hung F.Y., Tsai T.Y., Weng W.J., Hsu C.L., Dai B.T., Sensor. Actuat. B-Chem., 156 (2011), 906.10.1016/j.snb.2011.03.004Search in Google Scholar

[17] Sher B.K., Muhammad T.S.C., Karimov K.S., Abdullha M.A., Mehran B., Rana T., Talanta, 120 (2014), 443.10.1016/j.talanta.2013.11.08924468394Search in Google Scholar

[18] Robert B., Louis N., Electronic Devices and Circuit Theory, Prentice-Hall, New Jersey, 2006.Search in Google Scholar

[19] Ma C., Zhu L., Chen S., Zhao Y., Mater. Lett., 108 (2013), 11410.1016/j.matlet.2013.06.101Search in Google Scholar

[20] Sahooli M., Sabbaghi S., Saboori R., J. Mater. Sci. Lett., 81 (2012), 169.10.1016/j.matlet.2012.04.148Open DOISearch in Google Scholar

[21] Jia W., Reitz E., Shimpi P., Rodriguez E.G., Gao P.X., Lei Y., Mater. Res. Bull., 44 (2009), 1681.10.1016/j.materresbull.2009.04.003Search in Google Scholar

[22] Mohamed R.M., Harraz F.A., Shawky A., Ceram. Int., 40 (2014), 2127.10.1016/j.ceramint.2013.07.129Search in Google Scholar

[23] Dar M.A., Kim Y.S., Kim W.B., Sohn J.M., Shin H.S.J., Appl. Surf. Sci., 254 (2008), 7477.10.1016/j.apsusc.2008.06.004Search in Google Scholar

[24] Ibupoto Z.H., Khun K., Lu J., Willander M., Appl. Phys. Lett., 102 (2013), 103701.10.1063/1.4795135Search in Google Scholar

[25] Mukherjee N., Show B., Maji S.K., Madhu U., Bhar S.K., Mitra B.C., Khan G.G., Mondal A., Mater. Lett., 65 (2011), 3248.10.1016/j.matlet.2011.07.016Open DOISearch in Google Scholar

[26] Zhao J., Liu R., Hua Z., Superlattice. Microst., 81 (2015), 243.10.1016/j.spmi.2015.01.017Search in Google Scholar

[27] Yu Q., Huang H., Chen R., Wang P., Yang H., Gao M., Peng X., Ye Z., Nanoscale, 4 (2012), 2613.10.1039/c2nr30135k22426955Search in Google Scholar

[28] Anandan S., Lee G., Wu J.J., Ultrason. Sonochem., 19 (2012), 682.10.1016/j.ultsonch.2011.08.00921940191Open DOISearch in Google Scholar

[29] Toboonsung B., Singjai P., J. Alloy. Compd., 509 (2011), 4132.10.1016/j.jallcom.2010.12.180Search in Google Scholar

[30] Mallick P., Sahu S., Nanosci. Nanotechnol., 2 (2012), 71.10.5923/j.nn.20120203.05Search in Google Scholar

[31] Lamrizeggara M., Ghabane L., Aida M.S., Attaf N., Zebbar N., Mater. Sci. Semicon. Proc., 30 (2015), 645.10.1016/j.mssp.2014.09.026Search in Google Scholar

[32] Feng J.K., Xia H., Lai M.O., Lu L., Mater. Res. Bull., 46 (2011), 424.10.1016/j.materresbull.2010.12.006Open DOISearch in Google Scholar

[33] Jung A., Cho S., Cho W., Lee K.-H., Korean J. Chem. Eng., 29 (2012), 243.10.1007/s11814-011-0168-4Search in Google Scholar

[34] Siddiqui H., Qureshi M.S., Haque F.Z., Int. J. Sci. Eng. Res., 5 (2014), 173.Search in Google Scholar

[35] Zhu Y.F., Zhou G.H., Lin Y.B., Liu L., Cryst. Res. Technol., 47 (2012), 658.10.1002/crat.201200061Open DOISearch in Google Scholar

[36] Chen A., Long H., Li X., Li Y., Yang G., Lu P., Vacuum, 83 (2009), 927.10.1016/j.vacuum.2008.10.003Open DOISearch in Google Scholar

[37] Visalakshi S., Kannan R., Valanarasu S., Kathalingam A., Rajashabala S., J. Mater. Sci.- Mater. El., 27 (2016), 9179.10.1007/s10854-016-4954-ySearch in Google Scholar

[38] Goli M., Haratizadeh H., Abrishami M.E., Ceram. Int., 40 (2014), 16071.10.1016/j.ceramint.2014.07.136Search in Google Scholar

[39] Mema R., Yuan L., Du Q., Wang Y., Zhou G., Chem. Phys. Lett., 512 (2011), 87.10.1016/j.cplett.2011.07.012Search in Google Scholar

[40] Yuan L., Wang Y., Mema R., Zhou G., Acta Mater., 59 (2011), 2491.10.1016/j.actamat.2010.12.052Search in Google Scholar

[41] Kim Y.S., Hwang I.S., Kim S.J., Lee C.Y., Lee J.H., Sensor. Actuat. B-Chem., 135 (2008), 298.10.1016/j.snb.2008.08.026Search in Google Scholar

[42] William D.C., Materials Science and Engineering: An Introduction, John Wiley and Sons Inc., New York, 1997.Search in Google Scholar

[43] Akaltun Y., Çayir, T., J. Alloy. Compd., 625 (2015), 144.10.1016/j.jallcom.2014.10.194Search in Google Scholar

[44] Johan M.R., Suan M.S.M., Hawari N.L., Ching H.A., Int. J. Electrochem. Sc., 6 (2011), 6094.Search in Google Scholar

[45] Dodoo-Arhin D., Leoni M., Scardi P., Mol. Cryst. Liq. Cryst., 555 (2012), 17.10.1080/15421406.2012.634357Search in Google Scholar

[46] Srivastava R., Int. J. Pure Appl. Sci. Technol., 14 (2013), 9.Search in Google Scholar

[47] Cheng S.L., Chen M.F., Nanoscale Res. Lett., 7 (2012), 119.10.1186/1556-276X-7-119330550322330902Search in Google Scholar

[48] Orton J.W., Powell M.J., Rep. Prog. Phys., 43 (1980), 1263.10.1088/0034-4885/43/11/001Search in Google Scholar

[49] Sisman O., Kilinc N., Ozturk Z.Z., Sensor. Actuat. B-Chem., 236 (2016), 1118.Search in Google Scholar

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