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The influence of current on the structure of the intermetallic compound in solder alloys

Josef Skácel

Josef Skácel

Department of Microelectronics, Brno University of TechnologyBrno, Czech Republic
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Skácel, Josef
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Alexandr Otáhal

Alexandr Otáhal

Department of Microelectronics, Brno University of TechnologyBrno, Czech Republic
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Otáhal, Alexandr
  
Feb 13, 2025
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Published Online: Feb 13, 2025
Page range: 48 - 57
Received: Nov 17, 2024
DOI: https://doi.org/10.2478/jee-2025-0005
Keywords
© 2025 Josef Skácel et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Skácel, Josef
Department of Microelectronics, Brno University of TechnologyBrno, Czech Republic
Otáhal, Alexandr
Department of Microelectronics, Brno University of TechnologyBrno, Czech Republic
Language:
English
Publication timeframe:
6 times per year
Journal Subjects:
Engineering, Introductions and Overviews, Engineering, other
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