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Density, Microstructure, Strength and Fractography of Spark Plasma and Conventionally Sintered Mn Steels

M. Tenerowicz-Zaba

M. Tenerowicz-Zaba

AGH University of Science and Technology, Faculty of Metals Engineering and Industrial Computer ScienceCracow, Poland
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Tenerowicz-Zaba, M.
, 
M. Kupkova

M. Kupkova

Institute of Materials Research, Slovak Academy of SciencesKošice, Slovakia
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Kupkova, M.
, 
M. Kabatova

M. Kabatova

Institute of Materials Research, Slovak Academy of SciencesKošice, Slovakia
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Kabatova, M.
, 
E. Dudrova

E. Dudrova

Institute of Materials Research, Slovak Academy of SciencesKošice, Slovakia
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Dudrova, E.
, 
M. Dzupon

M. Dzupon

Institute of Materials Research, Slovak Academy of SciencesKošice, Slovakia
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Dzupon, M.
 and 
M. Sulowski

M. Sulowski

AGH University of Science and Technology, Faculty of Metals Engineering and Industrial Computer ScienceCracow, Poland
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Sulowski, M.
  
Mar 01, 2018
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Published Online: Mar 01, 2018
Page range: 93 - 103
DOI: https://doi.org/10.1515/pmp-2017-0010
Keywords
© 2017 M. Tenerowicz-Zaba et al., published by De Gruyter Open
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.
Tenerowicz-Zaba, M.
AGH University of Science and Technology, Faculty of Metals Engineering and Industrial Computer ScienceCracow, Poland
Kupkova, M.
Institute of Materials Research, Slovak Academy of SciencesKošice, Slovakia
Kabatova, M.
Institute of Materials Research, Slovak Academy of SciencesKošice, Slovakia
Dudrova, E.
Institute of Materials Research, Slovak Academy of SciencesKošice, Slovakia
Dzupon, M.
Institute of Materials Research, Slovak Academy of SciencesKošice, Slovakia
Sulowski, M.
AGH University of Science and Technology, Faculty of Metals Engineering and Industrial Computer ScienceCracow, Poland
Language:
English
Publication timeframe:
2 times per year
Journal Subjects:
Engineering, Mechanical Engineering, Fundamentals of Mechanical Engineering, Bioengineering and Biomedical Engineering, Biomedical Electronics, Materials Sciences, Materials Sciences, other
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