Accesso libero

Microstructure refinement mechanism of undercooled Cu55Ni45 alloys

Hongfu Wang

Hongfu Wang

School of Mechanical Engineering, North University of ChinaTaiyuan, China
Cerca questo autore su
Sciendo|Google Scholar
Wang, Hongfu
, 
Cheng Tang

Cheng Tang

School of Mechanical Engineering, North University of ChinaTaiyuan, China
Cerca questo autore su
Sciendo|Google Scholar
Tang, Cheng
, 
Hongen An

Hongen An

Faculty of Engineering, University Malaysia SabahKota Kinabalu, Malaysia
Cerca questo autore su
Sciendo|Google Scholar
An, Hongen
 e 
Yuhong Zhao

Yuhong Zhao

College of Materials Science and Engineering, North University of ChinaTaiyuan, China
Cerca questo autore su
Sciendo|Google Scholar
Zhao, Yuhong
  
07 dic 2021
Microstructure refinement mechanism of undercooled Cu55Ni45 alloys's Cover Image
INFORMAZIONI SU QUESTO ARTICOLO
Articolo precedente
Articolo Successivo
Cita
Scarica la copertina
Pubblicato online: 07 dic 2021
Pagine: 319 - 330
Ricevuto: 28 giu 2021
Accettato: 16 set 2021
DOI: https://doi.org/10.2478/msp-2021-0027
Parole chiave
© 2021 Hongfu Wang et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Wang, Hongfu
School of Mechanical Engineering, North University of ChinaTaiyuan, China
Tang, Cheng
School of Mechanical Engineering, North University of ChinaTaiyuan, China
An, Hongen
Faculty of Engineering, University Malaysia SabahKota Kinabalu, Malaysia
Zhao, Yuhong
College of Materials Science and Engineering, North University of ChinaTaiyuan, China
Lingua:
Inglese
Frequenza di pubblicazione:
4 volte all'anno
Argomenti della rivista:
Scienze materiali, Scienze materiali, altro, Nanomateriali, Materiali funzionali ed intelligenti, Caratteristica e proprietà dei materiali
Feed RSS della rivista