[[1] Farkas G., Bein M.C., Gaal L., Multi domain modelling of power LEDs based on measured isothermal and transient I-V-L characteristics, in Perry J. (Ed.), Proceedings of 22ndInternational Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Budapest, 2016, p. 181.10.1109/THERMINIC.2016.7749049]Search in Google Scholar
[[2] Poppe A., Microelectron. J., 46 (2015), 1138.10.1016/j.mejo.2015.09.013]Search in Google Scholar
[[3] Chang M.-H., Das D., Varde P.V., Pecht M., Microelectron. Reliab., 52 (2012), 762.10.1016/j.microrel.2011.07.063]Open DOISearch in Google Scholar
[[4] Song B.-M., Han B., Lee J.-H., Microelectron. Reliab., 53 (2013), 435.10.1016/j.microrel.2012.10.010]Search in Google Scholar
[[5] Górecki K., Ptak P., Microelectron. Reliab., 79 (2017), 440.10.1016/j.microrel.2017.03.024]Open DOISearch in Google Scholar
[[6] Górecki K., Dziurdzia B., Ptak P., Solder. Surf. Mt. Tech., 30 (2) (2018), 81.10.1108/SSMT-10-2017-0026]Search in Google Scholar
[[7] Dziurdzia B., Sobolewski M., Mikołajek J., Solder. Surf. Mt. Tech., 30 (2) (2018), 87.10.1108/SSMT-10-2017-0031]Open DOISearch in Google Scholar
[[8] Uddin S., Shareef H., Mohamed A., Hannan M.A., Przegląd Elektrotechniczny, 88 (11) (2011), 266.]Search in Google Scholar
[[9] Górecki K., Ptak P., Microelectron. Int., 32 (3) (2015), 152.10.1108/MI-01-2015-0013]Search in Google Scholar
[[10] Weir B., IEEE Spectrum, 49 (3) (2012), 42.10.1109/MSPEC.2012.6156864]Search in Google Scholar
[[11] Martin P.S., High power white LED technology for Solid State Lighting, Lumileds, 2005.]Search in Google Scholar
[[12] Krames M., Progress and future direction of LED technology. 2003, [Online], available at: http://www.netl.doe.gov/ssl/PDF’s/Krames.pdf.]Search in Google Scholar
[[13] Schubert E.F., Light emitting diodes. Second edition, Cambridge University Press, New York, 2008.]Search in Google Scholar
[[14] Górecki K., Microelectron. Reliab., 55 (2) (2015), 389.10.1016/j.microrel.2014.11.003]Search in Google Scholar
[[15] Bagnoli P.E., Casarosa C., Ciampi M., Dallago E., IEEE T. Power Electr., 13 (6) (1998), 1208.10.1109/63.728348]Search in Google Scholar
[[16] Górecki K., Ptak P., The influence of the mounting manner of the power LEDs on its thermal and optical parameters, in: Napieralski A. (Ed.), Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems MIXDES, Lublin, 2014, 303.10.1109/MIXDES.2014.6872206]Search in Google Scholar
[[17] Górecki P., Górecki K., Zarębski J., IOP Conf. Ser., 1033 (2018), 1.10.1088/1742-6596/1033/1/012001]Search in Google Scholar
[[18] Lasance C.J.M., Poppe A., Thermal management for LED applications, Springer Science+Business Media, New York, 2014.10.1007/978-1-4614-5091-7]Search in Google Scholar
[[19] Górecki K., Ptak P., Janicki M., Torzewicz T., Influence of cooling conditions of power LEDs on their electrical, thermal and optical parameters in: Napieralski A. (Ed.), Proceedings of 25thInternational Conference Mixed Design of Integrated Circuits and Systems MIXDES 2018, Gdynia, 2018, 237.10.23919/MIXDES.2018.8436629]Search in Google Scholar
[[20] Torzewicz T., Ptak P., Górecki K., Janicki M., Influence of LED Operating Point and Cooling Conditions on Compact Thermal Model Element Values, in Perry J. (Ed.), Proceedings of the 24thInternational Workshop on Thermal Investigations of ICs and Systems, Stockholm, 2018.10.1109/THERMINIC.2018.8593295]Search in Google Scholar
[[21] Górecki K., Ptak P., Modelling LED Lamps with Thermal Phenomena Taken into Account, in Perry J. (Ed.), Proceedings of 22ndInternational Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Budapest, (2016), 202.10.1109/THERMINIC.2016.7749052]Search in Google Scholar
[[22] http://fideltronik.com/pl/ accessed on 2018.09.28.]Search in Google Scholar
[[23] Datasheet XP-G2 diode, https://www.cree.com/led-components/media/documents/XLampXPG2.pdf, accessed on 2018.09.28.]Search in Google Scholar
[[24] Illes B., Skwarek A., Geczy A., Krammer O., Busek D., Int. J. Heat Mass Tran., 114 (2017), 613.10.1016/j.ijheatmasstransfer.2017.06.091]Search in Google Scholar
[[25] Livovsky L., Pietrikova A., Solder. Surf. Mt. Tech., 29 (1) (2017), 42.10.1108/SSMT-10-2016-0026]Search in Google Scholar
[[26] Synkiewicz B., Skwarek A., Witek K., Solder. Surf. Mt. Tech., 26 (1) (2014), 8.10.1108/SSMT-10-2013-0028]Search in Google Scholar
[[27] Ulzhöfer CH., SMT, 4 (2012), 1.]Search in Google Scholar
[[28] Data Sheet “ALPHA OM340 Solder paste”, https://alphaassembly.com/Products/Solder-Paste/OM-340 (2018), accessed on 2018.09.28.]Search in Google Scholar
[[29] Castellazzi A., Gerstenmaier Y.C., Kraus R., Wachutka G.K.M., IEEE T. Power Electr., 21 (3) (2006), 603.10.1109/TPEL.2006.872382]Open DOISearch in Google Scholar
[[30] Górecki K., Zarębski J., IEEE T. Comp. Pack. Man. Tech., 4 (3) (2014), 421.]Search in Google Scholar
[[31] Zarębski J., Górecki K., Appl. Math. Model., 31 (8) (2007), 1489.10.1016/j.apm.2006.04.018]Search in Google Scholar
[[32] Zarębski J., Górecki K., IEE Proc. Cicuits Dev. Sys., 153 (1) (2006), 46.10.1049/ip-cds:20050054]Search in Google Scholar
[[33] Raypah M.E., Devarajan M., Ahmed A.A., Sulaiman F., J. Appl. Phys., 123 (10) (2018), 105703.10.1063/1.5016359]Search in Google Scholar
[[34] Datasheet A/D Converter USB-1608G,https://www.mccdaq.com/pdfs/manuals/usb-1608g-series.pdf, accessed on 2018.09.28.]Search in Google Scholar
[[35] Datasheet of infrared camera Flir i5, http://www.amc-magazin.ro/PRODUSE-DOC/FLIR/FLIR%20i5.pdf, accessed on 2018.09.28.]Search in Google Scholar
[[36] Oettinger F.F., Blackburn D.L., Rubin S., IEEE T. Electron Dev., 23 (8) (1976), 831.10.1109/T-ED.1976.18495]Search in Google Scholar
[[37] Górecki K., Rogalska M., Zarębski J., Microelectron. Reliab., 54 (5) (2014), 978.10.1016/j.microrel.2013.09.014]Open DOISearch in Google Scholar
[[38] Górecki K., Ptak P., IEEE T. Instrum. Meas., (2019) in press, doi: 10.1109/TIM.2019.289404310.1109/TIM.2019.2894043]Open DOISearch in Google Scholar