Signal Sensing By The Architecture Of Embedded I/O Pad Circuits

Pubblicato online: 11 mar 2014

Pagine: 196 - 213

Ricevuto: 12 nov 2013

Accettato: 25 feb 2014

DOI: https://doi.org/10.21307/ijssis-2017-652

Parole chiave

Circuit under pad (CUP), electrostatic discharge (ESD), electromagnetic interference (EMI), gate-coupled circuit, gate-grounded nMOS (GGnMOS), human-body model (HBM)

© 2014 Shen-Li Chen et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.