Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

Pubblicato online: 28 giu 2016

Pagine: 177 - 184

Ricevuto: 25 mar 2015

DOI: https://doi.org/10.1515/jee-2016-0025

Parole chiave

electrically conductive adhesive, flexible substrate, shear strength, quantity of adhesives, factor analysis, glued joint

© Faculty of Electrical Engineering and Information Technology, Slovak University of Technology

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.