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Enhanced cryptographic performance and security using optimized edward-elgamal signature scheme for IoT and blockchain applications

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10 nov. 2024
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Figure 1:

Advantages of digital signatures.
Advantages of digital signatures.

Figure 2:

Model diagram.
Model diagram.

Figure 3:

Time for key generation, sign production, and signature verification.
Time for key generation, sign production, and signature verification.

Figure 4:

Performance metrics of the optimized signature scheme. (A) Time for signing process under different conditions, showing a significant reduction in processing time. (B) Comparative analysis of signing process time for larger datasets, reinforcing the results from part (A). (C) Transaction flow. (D) Validation of blocks.
Performance metrics of the optimized signature scheme. (A) Time for signing process under different conditions, showing a significant reduction in processing time. (B) Comparative analysis of signing process time for larger datasets, reinforcing the results from part (A). (C) Transaction flow. (D) Validation of blocks.

Key generation time (ms)

Dataset ECDSA Hyper-ECDSA Optimized Edward-Elgamal
DS1 120 110 85
DS2 130 115 90
DS3 125 112 87

Computational overhead (ms)

Dataset ECDSA Hyper-ECDSA Optimized Edward-Elgamal
Dataset 1 1.60 1.80 1.15
Dataset 2 1.65 1.85 1.18
Dataset 3 1.58 1.75 1.12

Signature verification time (ms)

Dataset ECDSA Hyper-ECDSA Optimized Edward-Elgamal
DS1 140 125 95
DS2 150 130 100
DS3 145 128 97

Signature generation time (ms)

Dataset ECDSA Hyper-ECDSA Optimized Edward-Elgamal
DS1 150 135 100
DS2 160 145 110
DS3 155 140 105

Attack resistance (success rate of attacks in %)

Attack type ECDSA Hyper-ECDSA Optimized Edward-Elgamal
Replay attack 5.0 4.5 1.5
Key reuse attack 3.0 2.5 0.5
Collision attack 2.0 1.5 0.2

Latency (ms)

Dataset ECDSA Hyper-ECDSA Optimized Edward-Elgamal
DS1 30 28 20
DS2 32 30 22
DS3 31 29 21

Throughput (transactions per second)

Dataset ECDSA Hyper-ECDSA Optimized Edward-Elgamal
DS1 66 74 100
DS2 62 69 95
DS3 64 72 98
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Sujets de la revue:
Ingénierie, Présentations et aperçus, Ingénierie, autres