Evaluating Joule Heating Effects and Electrical Current Flow Through Copper Layers Inside PCB Using Finite Element Analysis
, , , , et
08 juil. 2025
À propos de cet article
Publié en ligne: 08 juil. 2025
Pages: 45 - 59
Reçu: 07 mai 2025
Accepté: 05 juin 2025
DOI: https://doi.org/10.2478/bipcm-2025-0014
Mots clés
© 2025 George-Gabriel Chiriac et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Chiriac, George-Gabriel
“Gheorghe Asachi” Technical University of Iași, Faculty of Machine Manufacturing and Industrial ManagementIași, Romania
Academy of Romanian ScientistsBucharest, Romania
Prodan-Chiriac, Georgiana
“Gheorghe Asachi” Technical University of Iași, Faculty of Electrical EngineeringIași, Romania
Dumitraş, Cătălin Gabriel
“Gheorghe Asachi” Technical University of Iași, Faculty of Machine Manufacturing and Industrial ManagementIași, Romania
Chitariu, Dragoş-Florin
“Gheorghe Asachi” Technical University of Iași, Faculty of Machine Manufacturing and Industrial ManagementIași, Romania
Academy of Romanian ScientistsBucharest, Romania
Bumbu, Neculai-Eduard
“Gheorghe Asachi” Technical University of Iași, Faculty of Machine Manufacturing and Industrial ManagementIași, Romania
Academy of Romanian ScientistsBucharest, Romania
Oancea, Lucian
“Gheorghe Asachi” Technical University of Iași, Faculty of Machine Manufacturing and Industrial ManagementIași, Romania
Academy of Romanian ScientistsBucharest, Romania