Volumen 40 (2013): Edición 4 (December 2013) Special Edición Title: Proceedings of the 3rd Asia Pacific Conference on Luminescence and Electron Spin Resonance Dating Okayama, Japan, 2012
Volumen 40 (2013): Edición 3 (September 2013)
Volumen 40 (2013): Edición 2 (June 2013)
Volumen 40 (2013): Edición 1 (March 2013)
Volumen 39 (2012): Edición 4 (December 2012)
Volumen 39 (2012): Edición 3 (September 2012)
Volumen 39 (2012): Edición 2 (June 2012)
Volumen 39 (2012): Edición 1 (March 2012)
Volumen 38 (2011): Edición 4 (December 2011)
Volumen 38 (2011): Edición 3 (September 2011) Special Edición Title: Proceedings of the 2nd Asia Pacific Conference on Luminescence Dating, Ahmedabad, India, 2009. Part II Edición Editors: Andrzej Bluszcz, Silesian University of Technology, Gliwice, Poland. Andrzej.Bluszcz@polsl.pl Sheng-Hua Li, The University of Hong Kong, Hong Kong, China. shli@hku.hk Ashok Kumar Singhvi, Physical Research Laboratory, Ahmedabad, India. singhvi@prl.res.in
Volumen 38 (2011): Edición 2 (June 2011)
Volumen 38 (2011): Edición 1 (March 2011)
Volumen 37 (2010): Edición -1 (December 2010) Proceedings of the 2 Asia Pacific Conference on Luminescence Dating, Ahmedabad, India, 2009. Part I
Editors Andrzej Bluszcz, Sheng-Hua Li and Ashok Kumar Singhvi
In this work we investigate the quartz etching process using hydrofluoric acid for trapped charge dating (TCD) applications. It is done using material collected from an active sand mine in Bełchatów Nowy Świat, central Poland. Approximately 20 kg of material was collected and prepared using routine procedures that are applied in TCD laboratories. The material was sieved using 180–200 μm meshes, and the selected fraction was etched for various time intervals. Sieved samples were etched for durations from 0 min up to 180 min and measured with microscope image analysis (IA), laser diffraction (LD), and mass loss which were used to estimate the depths of etching. Our results show statistical data on how non-uniform the etching process is. We estimate this as a function of etching time from IA, LD and mass loss. In our investigation, mass loss measurements with the assumption of spherical grains correspond to the decrease of radius of ca. 0.151 ± 0.003 μm · min−1. In case of LD, a rough etch depth estimation corresponds to a range 0.06–0.18 μm · min−1 with median at 0.13 μm · min−1. Microscope IA gives a 0.03–0.09 μm · min−1 with a median at 0.05 μm · min−1. Moreover, quartz grains are fractured into smaller pieces while etching. It means that assumptions that are used in etch depth estimation from mass loss are not correct. They incorrect not only because grains are not spheres but also because the number of grains is not constant. Therefore, the etch depth estimated from mass loss might be overestimated. Using microscope IA we report etch depth ranges that might be used to roughly estimate the etch depth uncertainty.
This work considers the impact of the internal alpha and beta dose rates in quartz grains obtained from sandy sediments on the results of luminescence dating. The internal dose rates reported here (ca. 0.01–0.21 Gy · ka−1) play a particularly important role, because of low (ca. 0.8–0.9 Gy · ka−1) or very low (ca. 0.4–0.6 Gy · ka−1) external dose rates. In these cases, the internal dose rates form a significant fraction of the total dose rates, often exceeding 10%. Ignoring this contribution would have made the considered luminescence ages artificially older. In our study, we measure both the internal alpha and beta contributions as the latter is usually neglected in the case of quartz. The dose rate measurements were performed using the innovative μDose system.
In this work we investigate the quartz etching process using hydrofluoric acid for trapped charge dating (TCD) applications. It is done using material collected from an active sand mine in Bełchatów Nowy Świat, central Poland. Approximately 20 kg of material was collected and prepared using routine procedures that are applied in TCD laboratories. The material was sieved using 180–200 μm meshes, and the selected fraction was etched for various time intervals. Sieved samples were etched for durations from 0 min up to 180 min and measured with microscope image analysis (IA), laser diffraction (LD), and mass loss which were used to estimate the depths of etching. Our results show statistical data on how non-uniform the etching process is. We estimate this as a function of etching time from IA, LD and mass loss. In our investigation, mass loss measurements with the assumption of spherical grains correspond to the decrease of radius of ca. 0.151 ± 0.003 μm · min−1. In case of LD, a rough etch depth estimation corresponds to a range 0.06–0.18 μm · min−1 with median at 0.13 μm · min−1. Microscope IA gives a 0.03–0.09 μm · min−1 with a median at 0.05 μm · min−1. Moreover, quartz grains are fractured into smaller pieces while etching. It means that assumptions that are used in etch depth estimation from mass loss are not correct. They incorrect not only because grains are not spheres but also because the number of grains is not constant. Therefore, the etch depth estimated from mass loss might be overestimated. Using microscope IA we report etch depth ranges that might be used to roughly estimate the etch depth uncertainty.
This work considers the impact of the internal alpha and beta dose rates in quartz grains obtained from sandy sediments on the results of luminescence dating. The internal dose rates reported here (ca. 0.01–0.21 Gy · ka−1) play a particularly important role, because of low (ca. 0.8–0.9 Gy · ka−1) or very low (ca. 0.4–0.6 Gy · ka−1) external dose rates. In these cases, the internal dose rates form a significant fraction of the total dose rates, often exceeding 10%. Ignoring this contribution would have made the considered luminescence ages artificially older. In our study, we measure both the internal alpha and beta contributions as the latter is usually neglected in the case of quartz. The dose rate measurements were performed using the innovative μDose system.