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Publicado en línea: 06 oct 2020
Páginas: 253 - 262
Recibido: 11 may 2017
Aceptado: 23 abr 2019
DOI: https://doi.org/10.2478/msp-2020-0042
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© 2020 Jianning Li et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Li, Jianning
College of Electronic and Information Engineering, Hebei UniversityBaoding, China
Research Center for Computational Materials and Device Simulations, Hebei UniversityBaoding, China
Wu, Fang
College of Electronic and Information Engineering, Hebei UniversityBaoding, China
Shi, Jianying
College of Electronic and Information Engineering, Hebei UniversityBaoding, China
Ma, Lei
College of Electronic and Information Engineering, Hebei UniversityBaoding, China
Yan, Xiaobing
College of Electronic and Information Engineering, Hebei UniversityBaoding, China
Yang, Nan
College of Electronic and Information Engineering, Hebei UniversityBaoding, China
Ding, Bangfu
College of Electronic and Information Engineering, Hebei UniversityBaoding, China
Zheng, Shukai
College of Electronic and Information Engineering, Hebei UniversityBaoding, China
Research Center for Computational Materials and Device Simulations, Hebei UniversityBaoding, China