<abstract xmlns="http://www.w3.org/1999/xhtml"><p>Nanoindentation is a widely-used method for sensitive exploration of the mechanical properties of micromechanical systems. We derive a simple empirical analysis technique to extract stress-strain field (SSF) gradient and divergence representations from nanoindentation data sets. Using this approach, local SSF gradients and structural heterogeneities can be discovered to obtain more detail about the sample’s microstructure, thus enhancing the analytic capacity of the nanoindentation technique. We demonstrate the application of the SSF gradient-divergence analysis approach to nanoindentation measurements of bulk silicon.</p></abstract>

Nanoindentation is a widely-used method for sensitive exploration of the mechanical properties of micromechanical systems. We derive a simple empirical analysis technique to extract stress-strain field (SSF) gradient and divergence representations from nanoindentation data sets. Using this approach, local SSF gradients and structural heterogeneities can be discovered to obtain more detail about the sample’s microstructure, thus enhancing the analytic capacity of the nanoindentation technique. We demonstrate the application of the SSF gradient-divergence analysis approach to nanoindentation measurements of bulk silicon.

Nanoindentation Response analysis of Thin Film Substrates-I: Strain Gradient-Divergence Approach

Institute of Mechanical Engineering, Riga Technical University, 6 Ezermalas Str., LV-1006, Riga,

Institute of Neuroinformatics, University & ETH of Zurich, 190 Winterthurerstr., CH-8057 Zurich,

Latvian Journal of Physics and Technical Sciences

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Nanoindentation is a widely-used method for sensitive exploration of the mechanical properties of micromechanical systems. We derive a simple empirical...

Nanoindentation Response analysis of Thin Film Substrates-I: Strain Gradient-Divergence Approach

Publicado en línea: 30 mar 2017

Páginas: 66 - 76

DOI: https://doi.org/10.1515/lpts-2017-0007

Palabras clave
elastic-plastic deformation, nanoindentation, strain gradient plasticity, stress-strain field, true hardness, true elastic modulus

© 2017 U. Kanders et al., published by De Gruyter Open

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Nanoindentation Response analysis of Thin Film Substrates-I: Strain Gradient-Divergence Approach

Publicado en línea: 30 mar 2017

Páginas: 66 - 76

DOI: https://doi.org/10.1515/lpts-2017-0007

Palabras claveelastic-plastic deformation, nanoindentation, strain gradient plasticity, stress-strain field, true hardness, true elastic modulus

© 2017 U. Kanders et al., published by De Gruyter Open

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Palabras clave
elastic-plastic deformation, nanoindentation, strain gradient plasticity, stress-strain field, true hardness, true elastic modulus