Numerical Modelling of Interlayer Adhesion in the Layer of Recycled Material with the Use of the Leutner Apparatus and Computed Tomography Scanning
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28. Mai 2022
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Online veröffentlicht: 28. Mai 2022
Seitenbereich: 95 - 103
DOI: https://doi.org/10.30540/sae-2021-011
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© 2021 Grzegorz Mazurek et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.
Mazurek, Grzegorz
Kielce University of TechnologyPoland
Durlej, Małgorzata
Kielce University of TechnologyPoland
Iwański, Marek
Kielce University of TechnologyPoland