<abstract xml:lang="en" xmlns="http://www.w3.org/1999/xhtml"><p>One of the methods of achieving high packaging density of passive elements on the PCB is using the capacitors embedded in multilayer PCB. Test structures consisting of embedded capacitors were fabricated using the FaradFlex® capacitive internal layers. Impedance spectroscopy and equivalent circuit modelling was used to determine their electrical properties such as the capacitance, parasitic resistance and inductance. The use of several stages of accelerated ageing allowed us to test the durability of the structures. The results showed good quality stability of the embedded elements. The spatial distribution of the capacitance of the test structures on the surface of the PCB form was tested. The influence of the process parameters during lamination on the values of embedded capacitors was revealed.</p></abstract>

One of the methods of achieving high packaging density of passive elements on the PCB is using the capacitors embedded in multilayer PCB. Test structures consisting of embedded capacitors were fabricated using the FaradFlex® capacitive internal layers. Impedance spectroscopy and equivalent circuit modelling was used to determine their electrical properties such as the capacitance, parasitic resistance and inductance. The use of several stages of accelerated ageing allowed us to test the durability of the structures. The results showed good quality stability of the embedded elements. The spatial distribution of the capacitance of the test structures on the surface of the PCB form was tested. The influence of the process parameters during lamination on the values of embedded capacitors was revealed.

Electrical properties of dielectric foil for embedded PCB capacitors

Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, ul. Janiszewskiego 11/17, 50-372, Wrocław, Poland

Tele and Radio Research Institute, ul. Ratuszowa 11, 03-450, Warszawa, Poland

Materials Science-Poland

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

{"article-title":"Electrical properties of dielectric foil for embedded PCB capacitors"}

One of the methods of achieving high packaging density of passive elements on the PCB is using the capacitors embedded in multilayer PCB. Test structures...

Electrical properties of dielectric foil for embedded PCB capacitors

Online veröffentlicht: 14. Dez. 2012

Seitenbereich: 335 - 341

DOI: https://doi.org/10.2478/s13536-012-0057-5

Schlüsselwörter
impedance spectroscopy, equivalent circuit, dielectric foil, embedded elements, PCB

© 2012 Wroclaw University of Technology

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Electrical properties of dielectric foil for embedded PCB capacitors

Online veröffentlicht: 14. Dez. 2012

Seitenbereich: 335 - 341

DOI: https://doi.org/10.2478/s13536-012-0057-5

Schlüsselwörterimpedance spectroscopy, equivalent circuit, dielectric foil, embedded elements, PCB

© 2012 Wroclaw University of Technology

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Schlüsselwörter
impedance spectroscopy, equivalent circuit, dielectric foil, embedded elements, PCB