<abstract xmlns="http://www.w3.org/1999/xhtml">

<p>The main purpose of this paper is the analysis of the electrical resistivity of solder joints depending on various surface finishes and on the number of reflow processes. The electrical resistivity was determined after 1, 2, 3, 5 and 6 reflow cycles as a replacement for the basic accelerated aging test. In this article, various surface finishes are compared by measuring electrical resistivity of solder joints between two soldering pads. The influence of standard surface finishes (ENIG, Lead HASL, Lead-free HASL, Cu, ImSn) with the new developed surface finish based on SnAg7 is also compared. Measurements show that the electrical resistivity is dependent on surface finish type and the thickness of the solder joint. The results prove that the new developed surface finish based on SnAg7 is stable against multiple reflows and comparable to the surface finish based on Au. The new developed surface finish based on SnAg7 can be recommended as a replacement for other conventional surface finishes.</p>
</abstract>

The main purpose of this paper is the analysis of the electrical resistivity of solder joints depending on various surface finishes and on the number of reflow processes. The electrical resistivity was determined after 1, 2, 3, 5 and 6 reflow cycles as a replacement for the basic accelerated aging test. In this article, various surface finishes are compared by measuring electrical resistivity of solder joints between two soldering pads. The influence of standard surface finishes (ENIG, Lead HASL, Lead-free HASL, Cu, ImSn) with the new developed surface finish based on SnAg7 is also compared. Measurements show that the electrical resistivity is dependent on surface finish type and the thickness of the solder joint. The results prove that the new developed surface finish based on SnAg7 is stable against multiple reflows and comparable to the surface finish based on Au. The new developed surface finish based on SnAg7 can be recommended as a replacement for other conventional surface finishes.

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics

Research Institute for Physical Chemical Problems of the Belarusian State University

Acta Electrotechnica et Informatica

This work is licensed under the Creative Commons Attribution 4.0 International License.

{"article-title":"Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity"}

The main purpose of this paper is the analysis of the electrical resistivity of solder joints depending on various surface finishes and on the number of reflow...

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Online veröffentlicht: 13. Apr. 2022

Seitenbereich: 3 - 8

Eingereicht: 02. Feb. 2022

Akzeptiert: 08. März 2022

DOI: https://doi.org/10.2478/aei-2021-0001

Schlüsselwörter
surface finish, electrical resistivity, multiple reflows

© 2021 Daniel Dzivy et al., published by Sciendo

This work is licensed under the Creative Commons Attribution 4.0 International License.

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Online veröffentlicht: 13. Apr. 2022

Seitenbereich: 3 - 8

Eingereicht: 02. Feb. 2022

Akzeptiert: 08. März 2022

DOI: https://doi.org/10.2478/aei-2021-0001

Schlüsselwörtersurface finish, electrical resistivity, multiple reflows

© 2021 Daniel Dzivy et al., published by Sciendo

This work is licensed under the Creative Commons Attribution 4.0 International License.

Schlüsselwörter
surface finish, electrical resistivity, multiple reflows