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Polarization and EIS studies to evaluate the effect of aluminum concentration on the corrosion behavior of SAC105 solder alloy


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[1] MOHANTY U.S., LIN K.L., Appl. Surf. Sci., 252 (2006), 5907.Search in Google Scholar

[2] OSORIO W.R., SPINELLI J.E., AFONSO C.R.M., PEIXOTO L.C., GARCIA A., Electrochim. Acta, 56 (2011), 8891.10.1016/j.electacta.2011.07.114Search in Google Scholar

[3] LEONARDO R.G., OSORIO W.R., PEIXOTO L.C., GARCIA A., Mater. Charact., 61 (2010), 212.10.1016/j.matchar.2009.11.012Search in Google Scholar

[4] MOHANTY U.S., LIN K.L., J. Electrochem. Soc., 153 (2006), B319.10.1149/1.2209569Search in Google Scholar

[5] RAEDER C.H., FELTON L.E., TANZI V.A., KNORR D.B., J. Electron. Mater., 23 (1994), 611.10.1007/BF02653346Open DOISearch in Google Scholar

[6] TOMLINSON W.J., COLLIER I., J. Mater.Sci., 22 (1987), 1835.10.1007/BF01132413Search in Google Scholar

[7] HARADA M., SATOH R., IEEE Trans. Compon., Hybrids, Manuf. Technol., 13 (1990), 736.10.1109/33.62587Search in Google Scholar

[8] MCCORMACK M., JIN S., J. Electron. Mater., 23 (1994), 635.10.1007/BF02653349Search in Google Scholar

[9] SABRI M.F.M., DHAFER A.S., IRFAN A.B., SUHANA M.S., CHE F.X., TADASHI A., Mater. Charact., 78 (2013), 129.10.1016/j.matchar.2013.01.015Open DOISearch in Google Scholar

[10] XU L., PANG J.H.L., CHE F., J. Electron. Mater., 37 (2008), 880.10.1007/s11664-008-0400-0Search in Google Scholar

[11] YOU T., KIM Y., KIM J., LEE J., JUNG B., MOON J., J. Electron. Mater., 38 (2009), 410.10.1007/s11664-008-0633-ySearch in Google Scholar

[12] LIU W., LEE N.C., JOM, 59 (2007), 26.10.1007/s11837-007-0085-5Search in Google Scholar

[13] HUANG B., HWANG H.S., LEE N.C., Proc. Electronic Components and Technology Conf. (IEEE), 2007, 184.Search in Google Scholar

[14] BIRZER C., RAKOW B., STEINER R., WALTER J., Proc. Electronics Packaging Technology Conf. (IEEE), 2005, 255.Search in Google Scholar

[15] ZHAO X.J., CAERS J.F.J.M., DE VRIES J.W.C., KLOOSTERMAN J., WONG E.H., RAJOO R., Proc. Electronics Packaging Technology Conf. (IEEE), 2006, 174.Search in Google Scholar

[16] KIM D., SUH D., MILLARD T., KIM H., KUMAR C., ZHU M., XU Y., Proc. Electronic Components and Technology Conf. (IEEE), 2007, 1614.Search in Google Scholar

[17] SUH D., KIM D. W., LIU P., KIM H., WENINGER J.A., KUMAR C.M., PRASAD A., GRIMSLEY B.W., TEJADA H.B., Mater. Sci. Eng., A, (2007), 595.10.1016/j.msea.2007.01.145Open DOISearch in Google Scholar

[18] KITTIDACHA W., KANJANAVIKAT A., VATTAANANIYOM K., Proc. Electronics Packaging Technology Conf. (IEEE), 2008, 1074.Search in Google Scholar

[19] KARIYA Y., HOSSI T., TERASHIMA S., TANAKA M., OTSUKA M., J. Electron. Mater., 33 (2004), 321.10.1007/s11664-004-0138-2Open DOISearch in Google Scholar

[20] WEI C., LIU Y.C., YU L.M., CHEN H., WANG X., Microelectron. Reliab., 50 (2010), 1142.10.1016/j.microrel.2010.04.023Search in Google Scholar

[21] DHAFER A.S., SABRI M.F.M., IRFAN A.B., SUHANA M.S., CHE F.X., J. Mater. Sci. Mater. El., 23 (2012), 1988. Search in Google Scholar

[22] LEE Y.W., KIM I.H., KIM E.S., LEE J.H., MOON J.T., Proc. Electronics Packaging Technology Conf. (IEEE), 2010, 429.Search in Google Scholar

[23] STIRRUP B.N., HAMPSON N.A., Surf. Technol., 5 (1977), 429.10.1016/0376-4583(77)90011-5Search in Google Scholar

[24] DROGOWSKA M., MENARD H., BROSSARD L., J. Appl. Electrochem., 21 (1991), 84.10.1007/BF01103835Search in Google Scholar

[25] PISTORIUS P.C., BURSTEIN G.T., Corros. Sci., 38 (1994), 1525.10.1038/372038a0Search in Google Scholar

eISSN:
2083-134X
Sprache:
Englisch
Zeitrahmen der Veröffentlichung:
4 Hefte pro Jahr
Fachgebiete der Zeitschrift:
Materialwissenschaft, andere, Nanomaterialien, Funktionelle und Intelligente Materialien, Charakterisierung und Eigenschaften von Materialien