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Journals
Research Papers Faculty of Materials Science and Technology Slovak University of Technology
Volume 26 (2018): Issue 43 (September 2018)
Open Access
The Effect of Increased Cu Content on Microstructure and Melting of Utilized Sn-0.3Ag-0.7Cu Solder
Marián Drienovský
Marián Drienovský
,
Lýdia Rízeková Trnková
Lýdia Rízeková Trnková
,
Roman Čička
Roman Čička
,
Pavol Priputen
Pavol Priputen
,
Marcela Pekarčíková
Marcela Pekarčíková
and
Jozef Janovec
Jozef Janovec
| Feb 23, 2019
Research Papers Faculty of Materials Science and Technology Slovak University of Technology
Volume 26 (2018): Issue 43 (September 2018)
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Published Online:
Feb 23, 2019
Page range:
33 - 44
Received:
Oct 29, 2018
Accepted:
Jan 09, 2019
DOI:
https://doi.org/10.2478/rput-2018-0028
Keywords
Low-silver Sn–Ag–Cu solder
,
intermetallic compound
,
solidification
,
thermodynamic calculations
© 2018 Marián Drienovský et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.
Marián Drienovský
Slovak University Of Technology In Bratislava, Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science
Trnava
Lýdia Rízeková Trnková
Slovak University Of Technology In Bratislava, Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science
Trnava
Roman Čička
Slovak University Of Technology In Bratislava, Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science
Trnava
Pavol Priputen
Slovak University Of Technology In Bratislava, Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science
Trnava
Marcela Pekarčíková
Slovak University Of Technology In Bratislava, Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science
Trnava
Jozef Janovec
Slovak University Of Technology In Bratislava, University Science Park,
Bratislava