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Research Papers Faculty of Materials Science and Technology Slovak University of Technology
Volume 22 (2014): Issue 34 (June 2014)
Open Access
Research of Interaction Between Zn Based Solders and Cu, Al Substrates
Michal Prach
Michal Prach
,
Igor Kostolný
Igor Kostolný
and
Roman Koleňák
Roman Koleňák
| Nov 25, 2014
Research Papers Faculty of Materials Science and Technology Slovak University of Technology
Volume 22 (2014): Issue 34 (June 2014)
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Published Online:
Nov 25, 2014
Page range:
59 - 65
DOI:
https://doi.org/10.2478/rput-2014-0028
Keywords
zinc solders
,
ultrasonic soldering
,
copper
,
aluminium
,
higher application temperatures
© by Michal Prach
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.